Technologie-News vom 15.11.2021
Technologie-News vom 15.11.2021 Toposens introduces new ultrasonic 3D sensor featuring Infineon’s XENSIV™ MEMS microphone Toposens has partnered up with Infineon Technologies AG to realize 3D obstacle detection and collision avoidance. These are used in autonomous systems using Toposens‘ proprietary 3D Mehr