At Laser World of Photonics in Munich, Finetech will present the successor of its acclaimed sub-micron bonder for research and development. Technological innovations make the high-precision placement and assembly system the ideal starting point for cost-efficient and fast development of optoelectronic products.

As a manufacturer of micro assembly equipment and process technology, Finetech has been supporting start-ups as well as global technology leaders in the development of innovative semiconductor products for more than two decades. The FINEPLACER® lambda – the worldwide epitome of a versatile, high-precision and compact R&D die bonding system with an unrivaled price/performance ratio – is a cornerstone in Finetech’s product line-up.

At Laser World of Photonics, the Berlin-based company presents the successor of this successful model. The FINEPLACER® lambda 2 continues the virtues of its predecessor and sets new benchmarks in optoelectronics assembly.

High-precision placement and assembly
With the FINEPLACER® lambda 2, components can be placed and bonded with an accuracy of better than 1 micrometer – ideal for the high requirements, e.g. in the development of opto-electronic products such as transceivers (TOSA/ROSA) or laser diode modules.

Thanks to the proven FINEPLACER® alignment and placement principle with only one moving axis, the system provides highest process quality, stability and accuracy. In combination with specially developed interchangeable optics with a resolution of down to 0.7 µm, it enables overlaying images of the highest optical quality. Even finest structures in sub-micrometer range can be reliably detected and aligned. For each application, the user can choose between different image field sizes to ensure optimum viewing conditions for all supported component dimensions.

Modularity for flexible use
The completely revised bonding platform is still available in manual or semi-motorized configurations and can now be equipped even more conveniently with a variety of extension modules for very different assembly and bonding technologies, including eutectic soldering, thermocompression bonding or bonding with UV-curing adhesives.
This technological diversity opens up a particularly wide range of applications, which can be further extended by a large bonding force range.

Thanks to the modular system architecture, the machine always remains flexible: if, for example, applications are to be bonded with ultrasound at a later point in time, the required process module can simply be retrofitted by the user himself via plug & play.

Process development cannot be more flexible, at the same time follow-up costs are kept low and the future security of the investment is guaranteed even with changing application requirements. That makes the FINEPLACER® lambda 2 the ideal proposal for users in education, research and development who continually need to implement new and adapted technologies and processes.

Focus on the user
During the development of the FINEPLACER® lambda 2, Finetech has consistently focused on the needs of the user. Thanks to the ergonomic machine design and software-assisted user guidance, the operator always remains at the center of action.

For greater comfort and safety, all operating elements have been adapted to typical work sequences. This allows the user to focus on the essentials and achieve results in no time. The uniform operating concept with clearly structured process sequences also ensures a quick familiarization with the machine.

The library-based toolbox design of the newly developed IPM Command operating software simplifies the setup and modification of process sequences. Instead of predefined scripts, the user can freely create, modify and combine sequences. The visual representation of all process components and parameters in real time enables an intuitive and efficient process design.

Due to the intelligent user guidance, user errors can be minimized.

Starting point for product development
With IPM Command, the FINEPLACER® lambda 2 also follows Finetech’s integrated software concept. Whether prototyping device or production system – all new FINEPLACER® machines are based on the same software platform. Processes created and certified during the development phase can be quickly and easily transferred to Finetech’s automated production systems. This enables a seamless transition from development to series production and a fast ramp-up of production.

With sub-micron accuracy from development to series production. The FINEPLACER® lambda 2 is the ideal starting point for successful product development in optoelectronics.

Finetech at the Laser World of Photonics in Munich
The European premiere of the new FINEPLACER® lambda 2 will take place from 24 to 27 June 2019 at the Laser World of Photonics in Munich, hall B2, booth 212.

Über die FINETECH GmbH & Co. KG

Finetech is a leading equipment supplier for sub-micron die bonding and advanced die packaging. With a portfolio comprised of manual and semi-automated die bonders for R&D and prototyping as well as full-automatic bonding platforms for production environments, Finetech offers integrated equipment solutions for each stage of the product development chain.

Finetech helps technology start-ups and industry leaders worldwide to develop and manufacture innovative semiconductor products. Served customers are companies e.g. in the fields of datacom & telecom, medical technologies & life sciences, consumer electronics,industrial semiconductor, aerospace & avionics, automative & transportation, as well as academic and scientific institutions.

The modular hardware and software architecture allows individual machine configurations. New processes and technologies can be added via extension modules to ensure optimal process environments for each type of application. Available bonding technologies include eutectic soldering, adhesive, ultrasonic and vacuum die bonding, laser-assisted bonding, thermocompression and sintering.

Finetech responds flexibly to specific requirements and offers tailor-made solutions to highly-demanding customer applications. The company is represented by direct subsidiaries in its core markets and offers on-site application support and advice. It is also represented world-wide by a network of agencies.

Finetech is headquartered in Berlin, Germany, with subsidiaries in the USA, China, Malaysia, and Japan.

Firmenkontakt und Herausgeber der Meldung:

FINETECH GmbH & Co. KG
Boxberger Str. 14
12681 Berlin
Telefon: +49-30-936681-0
Telefax: +49-30-936681-144
http://www.finetech.de

Ansprechpartner:
Daniel Staubach
Marketing
Telefon: +49 (30) 936681-330
Fax: +49 (30) 936681-45
E-Mail: daniel.staubach@finetech.de
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