In the future, 50% of the data generated will not be produced by people, but by systems in vehicles and network devices. At the same time, 75% of all data will already be processed at the edge of the network. As a result, the market for edge computers will grow by 50% annually and is expected to reach in 2025 a turnover of around 30 billion dollars. The global data volume will increase to five times today’s data traffic. A self-driving vehicle, whether manned or unmanned, will then generate data of 4 TB per day. The fifth generation of mobile network, the 5G network, was defined for these applications. 5G delivers a data throughput 100 times higher than LTE, very short latency times in the millisecond range and high availability and reliability.

There are several use cases of the 5G network. The mobile user needs high bandwidth for example for 8K video streaming, mobile gaming, and virtual reality applications. For the operation of wireless stationary broadband connections, a data throughput of more than 100 Mbit/s is important. Other applications include connecting household appliances, building controls or smart cities to the IoT. The most important applications include time-critical control systems for autonomous driving and industrial plant automation. The number of edge devices such as mobile devices, vehicles, household appliances, drones, and other components and thus the amount of data is increasing dramatically. At the same time, latency times must be greatly reduced due to time-critical applications. It is assumed that 75 billion edge devices will be in use in 5 years. Latencies of less than 10 milliseconds between the cloud and the user are necessary without losing scalability and resources. Performance-intensive computing activities should not take place in the end device, but at the point of data origin, so that response times are reduced to a few milliseconds. This also ensures that mobile devices do not become even more complex despite an increasing range of functions, that energy consumption does not increase drastically, and that weight and costs remain within limits.

Why edge computing is so important can be seen in the example of autonomous driving. A vehicle is stationary for more than 90% of its lifetime. Therefore, computing power is shifted to edge devices in order to avoid installing expensive computer components in the vehicle and at the same time to be able to serve a large number of vehicles. For image processing and video analysis of camera drones, it also makes sense to move the data processing to edge computing devices in order to keep the weight and costs of the drones in check. Other applications include the implementation of blockchain, the calculation of virtual reality models or the control of production facilities in real time. The connection to the mobile end device does not always have to be carried out in 5G technology. Wi-Fi connections can also be used, as they have a similar performance to 5G.

5G as a new mobile communication technology and edge computing with the network technologies used such as 5G, Wi-Fi 6 and NB IoT offers the possibility of new smart services but requires immense storage to keep the resulting data in stock at the edge.

Many 5G systems need to function in harsh outdoor environments. Innodisk, as one of the leading manufacturers of industrial memory products, offers a complete range of DRAM modules, including modules with extended temperature specifications that can withstand ranges from -40°C to +85°C, as well as the option of an acrylic coating that further protects the DRAM from moisture, dust and all kinds of contaminants that can cause corrosion in harsh outdoor conditions. The Taiwanese memory specialist guarantees a lifetime warranty on its products, which includes testing, repair, and spare parts. The DDR4 and new DDR5 industrial series are high-quality memory modules designed for 5G applications, edge computing and IoT, offering a complete turnkey solution. Customization services in hardware are possible, according to Innodisk. The special Rugged DIMM module series have a pair of mounting holes for more secure mounting on the CPU board. Therefore, they are shock and vibration resistant for stable system operation. A special DRAM module add-on helps passively disperse heat to cool the module by 4 to 5 percent more. A high-quality acrylic coating provides protection against moisture, contaminants as well as dust and acidic or alkaline materials. The coating thickness ranges from 0.03 mm to 0.13 mm and complies with IPC-A-610 standards for electronic components.

The Wide Temperature DRAM modules are designed for applications in harsh environments and are equipped with 30μ Gold Finger to ensure quality even in the extended temperature range of -40°C to +85°C. All DDR4 modules are covered by anti-sulfuration material to ensure smooth operation even in harsh environments. The so-called side-fill technology improves the reliability of the module and extends product life when operating under severe shaking or heavy thermal cycling. Resin is applied to three sides of the DRAM IC to reinforce the BGA and PCB interconnect so that 1.5 times mechanical stress can be tolerated.

The DDR4-3200 DRAM series modules were developed by Innodisk Corp. specifically for Edge Computing/5G. They are available in capacities of 4GB, 8GB, 16GB and 32GB for SODIMM, UDIMM and RDIMM form factors including optional ECC. The RDIMM VLP variant is available in 16GB and 32GB capacities. The complete 3200MT/s product line also supports 2933MT/s.

The full product range includes registered DIMMs for use in servers and IoT with capacities from 2GB to 64GB and speeds from 1333MT/s to 3200MT/s. Mini DIMMs for use in servers are available in capacities from 2GB to 16GB and speeds from 1600MT/s to 2400MT/s. A low-profile series with capacities from 2GB to 32GB. For use in harsh environments, the Mounting Rugged SODIMM series has been developed with capacities of 4GB, 8GB and 16GB. A series specifically for the extended temperature range is also available, as well as an ECC series and a non-ECC series.

The proprietary iRAM stress test software integrates a variety of test patterns and system levels to ensure that the quality and reliability of the modules are error-free. In the process, test time can be reduced by half and test stringency increased by 150 to 200 per cent.

Innodisk addresses four different vertical markets in DRAM. The server market segment includes network/5G, high performance computing, and cloud and edge computing. The AIoT vertical market includes manufacturing, kiosk and retail systems, robotics and AI, and automation technology. Products in the Ruggedized market segment include smart driving, outdoor signage, aerospace, and power generation. In the Industrial market segment, Innodisk addresses healthcare, gaming, surveillance, and construction.

For more information, visit www.innodisk.com.

Firmenkontakt und Herausgeber der Meldung:

Innodisk Europe B.V.
Pisanostraat 57
NL5623CB Eindhoven
Telefon: +49 (152) 5100 6027
http://www.innodisk.com/

Ansprechpartner:
Yvonne Liu
Telefon: +886 277033000
E-Mail: Yvonne_Liu@innodisk.com
Edgar Huber
Marcom360
Telefon: +49 (7083) 933745
E-Mail: edgar.huber@marcom360.de
Joyce Srithananan
Joyce Srithananan +31-40-200-20-17 joyce_srithananan@innodisk.com
Telefon: +31 (40) 20020-17
E-Mail: joyce_srithananan@innodisk.com
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