Dymax Launches 9310 Adhesive for High-Reliability PCB Reinforcement

Designed for advanced electronics and AI hardware, 9310 cures in seconds with light, delivering a fast, streamlined alternative to traditional underfill. A secondary heat cure ensures full polymerization in shadowed areas, supporting consistent performance across complex assemblies.

Dymax 9310 maintains adhesion through high-temperature reflow. It is formulated to flex under strain, helping absorb movement caused by thermal expansion and reducing stress on solder joints and components. Its combination of high elongation (145%) and controlled modulus allows the material to accommodate thermal and mechanical strain, helping maintain bond integrity over time in demanding environments.

The adhesive’s high viscosity and thixotropic profile enable precise edge bonding without unwanted flow. This improves placement control and overall process consistency. The material is also reworkable at relatively low temperatures, supporting greater manufacturing flexibility.

“9310 makes it easier to reinforce components quickly and consistently, without the added steps and complexity of underfill,” said Doug Katze, Senior Electronics Business Development Manager for Dymax.