• Railway AI & Rugged Computing: EN 50155-compliant AI platforms and modular CPCI Serial systems for real-time vision analytics, obstacle detection, track monitoring, and predictive maintenance.
  • Connected Onboard PIDS: Passenger information display systems integrated with 5G Train-to-Ground gateways to deliver seamless telemetry, failover reliability, and real-time passenger updates.
  • Next-Gen Station Displays: 49.5-inch stretched overhead displays for high-density platform timetables, alongside ultra-low-power, solar-compatible outdoor ePaper signage in B/W and color.

ADLINK Technology Inc., a global leader in edge computing, announced its participation at InnoTrans 2026, the world’s leading trade fair for transport technology, taking place September 22–25 at Messe Berlin. Exhibiting in Hall 4.1, Booth 672, ADLINK will highlight its latest railway solutions and intelligent systems designed to drive digital transformation across rail infrastructure under the theme: "Bridging AI to Smart Rail: Empowering Intelligent Railway Operations."

At this year’s show, ADLINK’s showcase is structured around three core pillars, each engineered to address critical operational challenges faced by rail operators, train builders, and system integrators:

1. Railway AI & Edge Inference Computing

To accelerate autonomous operations, obstacle detection, and predictive maintenance, ADLINK will display its high-performance all new AVA-7200 rugged AI inference platform. Featuring the latest Intel® Core™ Ultra Series 3 processors and NVIDIA RTX PRO™ embedded MXM GPU, these solutions deliver real-time vision processing in harsh railway environments while adhering to EN 50155 standards.

Highlighting a strategic collaboration in CompactPCI Serial architecture, ADLINK will feature its partnership with Elma Electronic. This joint initiative integrates Elma’s rugged chassis and backplane technology with ADLINK’s high-performance CompactPCI Serial CPU, GPU, and versatile I/O modules, providing rail operators with a scalable and highly reliable computing architecture.

2. Connected Onboard Passenger Information Systems (PIDS)

Bridging the gap between moving vehicles and central management, ADLINK presents a unified onboard PIDS architecture with its panel powered by AUO Display Plus. Integrated with onboard content servers and 5G Train-to-Ground gateways, the solution demonstrates low-latency telemetry, automated passenger updates, and seamless failover connectivity.

3. Smart Station & Platform Display Solutions

Modern transit hubs demand high-visibility, energy-efficient signage. ADLINK will highlight its 49.5-inch stretched overhead sign display, specifically designed for high-density platform timetables and trackside advisories. Additionally, ADLINK will feature its outdoor 13.3-inch and 40-inch ePaper solutions in both high-contrast Black/White and color versions, powered by ADLINK’s self-designed boards and rugged housings for outdoor use. These solutions are also solar-compatible, with ultra-low power consumption, helping solve power supply challenges.

"As the global rail industry transitions toward higher automation and enhanced passenger expectations, computing at the edge becomes the ultimate enabler," said Ryan Chiu, VP of ADLINK DMS+ & Rugged Computing BU. "At InnoTrans 2026, we are demonstrating how our EN 50155-compliant NVIDIA-embedded computing platforms, resilient 5G gateways, and highly reliable onboard/platform displays work together to form a dependable digital backbone for smart railway networks worldwide."

Event Details & VIP Booking

  • Event: InnoTrans 2026
  • Dates: September 22 – 25, 2026
  • Location: Messe Berlin GmbH, Germany
  • ADLINK Booth: Hall 4.1, Booth #672

ADLINK’s team of railway hardware engineers and product specialists will be available on-site for technical consultations and private briefings in the dedicated space within the booth. To schedule meetings or request technical demonstrations, visit https://www.adlinktech.com/en/innotrans-2026.

Über die ADLINK Technology GmbH

ADLINK Technology Inc. (TAIEX: 6166) is a global leader in embedded and edge AI computing, enabling intelligence at the edge for mission-critical applications. ADLINK designs and manufactures edge hardware and software for embedded, distributed, and intelligent computing. Over 1,600 global customers trust ADLINK in mission-critical sectors.

With 31 years of innovation, ADLINK offers a broad portfolio of products—including computer-on-modules, industrial motherboards, edge servers, and AI platforms. ADLINK provides both commercial off-the-shelf (COTS) products and customized design and manufacturing services to meet diverse needs.

ADLINK collaborates with Intel, NVIDIA, MediaTek, Ampere, AUO, and more, and has actively supported open-source and robotics initiatives across 20+ consortiums worldwide. Learn more at www.adlinktech.com or follow us on [url=https://www.linkedin.com/company/adlink-technology/]LinkedIn[/url], [url=https://x.com/ADLINK_IoT]X[/url], and [url=https://www.facebook.com/ADLINKTECH/]Facebook[/url].

Firmenkontakt und Herausgeber der Meldung:

ADLINK Technology GmbH
Hans-Thoma-Str. 8-10
68163 Mannheim
Telefon: +49 (621) 4321466
Telefax: +49 (621) 4321430
http://www.adlinktech.com

Ansprechpartner:
Chi Angela Lan
EMEA Marketing Manager
E-Mail: chi.lan@adlinktech.com
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