Firma congatec, Autor bei Presse-Blog

congatec and Kontron partner on embedded computing solutions

11. März 202616. März 2026 Firma congatecHardwareagility, aReady.YOURS, automation, computing, congatec, embedded, innovation, integration, iot, modular?, regulatory, solutions, systems?, technology, turnkey

congatec – the leading provider of embedded and edge computing technology – is expanding its portfolio of customized embedded computing platforms. With the launch of the aReady.YOURS Partner Program, the company is strengthening its ability to deliver added value to Mehr

congatec und Kontron schließen Partnerschaft für Embedded Computing Lösungen

11. März 202616. März 2026 Firma congatecHardwareAgilität, Branchenlösungen, computing, embedded, Embedded Systeme, Hardware-Integration, iot, kontron, Marktanpassung, oems, Plattformen, Qualitätsstandards, Systemdesigns, zertifizierungen

congatec – der führende Anbieter von Embedded und Edge Computing Technologie – erweitert sein Lösungsangebot für kundenspezifische Embedded-Computing-Plattformen. Mit dem aReady.YOURS-Partner-Programm zündet das Unternehmen die nächste Wertschöpfungsstufe für OEMs. Ziel ist es, gemeinsam mit Lösungspartnern schlüsselfertige Systemdesigns für Märkte mit Mehr

conga-TCRP1 combines high performance with maximum scalability and design flexibility

11. März 202616. März 2026 Firma congatecHardwareAI applications, amd, conga-TCRP1, edge computing, embedded systems, High Performance Computing, performance, performance optimization, real-time workloads, Ryzen AI P100, Scalability, scalable architecture

congatec – the leading vendor of embedded and edge computing technology – is enhancing the performance and scalability of its AMD Ryzen™ AI Embedded P100 Series COM Express 3.1 Type 6 Compact modules. The conga-TCRP1 is now available in six new variants with Mehr

Skalierbare Edge-Performance für anspruchsvolle Applikationen

11. März 202616. März 2026 Firma congatecHardwareAI, computing, conga-TCRP1, datensicherheit, Echtzeit-Workloads, edge computing, embedded, Hardwarelösungen, High Performance, industrie 4.0, Medical-Technologie, performance, Robotik, Skalierbarkeit, smart city

congatec – der führende Anbieter von Embedded- und Edge-Computing-Technologie – erhöht die Performance und Skalierbarkeit seiner AMD Ryzen AI Embedded P100 Series basierten COM Express 3.1 Type 6 Compact Module. Das conga-TCRP1 ist ab sofort in sechs neuen Varianten mit Mehr

aReady.YOURS from congatec for fast and reliable (full) custom embedded computing designs

11. März 202616. März 2026 Firma congatecHardwareapplication, computer-on-modules, computing, cooling, design, embedded, embedded design, engineering, full custom designs, integration, Manufacturing, partnership, services, solution, turnkey

congatec – the leading provider of embedded and edge computing technology – today announced its new Customer Application Center and the launch of aReady.YOURS. With this move, congatec expands its aReady. hardware and software building blocks portfolio to include comprehensive customization design Mehr

congatec expands its highly skilled engineering team, establishing congatec Asia Embedded Design subsidiary

27. Januar 202629. Januar 2026 Firma congatecHardwarecomputing, congatec, congatec new subsidiary, custom solutions, embedded, embedded R&D hub, engineering, innovation, penang, semiconductor

congatec – the leading vendor of embedded and edge computing technology – today announced the establishment of its new subsidiary in Penang, Malaysia, marking a strategic expansion of its engineering and research footprint in Asia. The move signals congatec’s commitment Mehr

congatec launcht COM Express Compact Modul auf Basis der neuesten AMD Ryzen™ AI Embedded P100 Prozessorserie

20. Januar 202623. Januar 2026 Firma congatecHardwareAI at the edge, AMD Ryzen Embedded AI P100, COM Express, COM Express with Ryzen P100, Computer-on-Module, Edge, embedded, embedded NPU

congatec – der führende Anbieter von Embedded- und Edge-Computing-Technologie – gibt den Launch einer neuen COM Express 3.1 Type 6 Compact Modulserie bekannt. Die neuen conga-TCRP1 basieren auf den neuesten AMD Ryzen™ AI Embedded P100 Series Prozessoren mit 4 oder Mehr

congatec launches COM Express Compact module based on the latest AMD Ryzen™ AI Embedded P100 processor series

20. Januar 202623. Januar 2026 Firma congatecHardwareAI accelerators, AMD P100 Ryzen, AMD Ryzen AI Embedded, COM Express, COM Express with AMD Ryzen AI embedded, Computer-on-Module, congatec, energy efficiency, industrial applications, industrial automation, rugged computing

congatec – the leading provider of embedded and edge computing technology – today launched a new COM Express 3.1 Type 6 Compact module series. The new conga-TCRP1 modules are based on the latest AMD Ryzen™ AI Embedded P100 Series processors Mehr

congatec expands its Computer-on-Module portfolio with 18 new product families

8. Januar 20269. Januar 2026 Firma congatecHardwareacquisition, Computer-on-Module, congatec, CPU density, design optimization, edge computing, embedded systems, global support, hardware innovation, JUMPtec, market leadership, module integration, portfolio, product families, technology roadmap

congatec – a leading vendor of embedded and edge computing technology – is expanding its Computer-on-Module portfolio with 18 new JUMPtec product families. The move follows the acquisition of Kontron’s module business in July 2025. As a result, customers now Mehr

congatec Computer-on-Modules fast-track Intel Core Ultra Series 3 processors for embedded AI without discrete accelerator cards

6. Januar 2026 Firma congatecHardwareaccelerator cards, AI acceleration, Compact design, computer-on-modules, congatec, Deep Learning, edge computing, embedded ai, energy efficiency, Hardware solutions, high-reliability systems, Intel Core Ultra Series 3, IoT Integration, machine learning, modular architecture

congatec – a leading vendor of embedded and edge building blocks – today launched the industry’s broadest portfolio of Computer-on-Modules (COMs) based on Intel Core Ultra Series 3 processors . The new high-performance modules deliver up to 180 TOPS of Mehr

Autor: Firma congatec