Firma congatec, Autor bei Presse-Blog

conga-TC300 – der ideale Einstieg in Edge-KI

16. April 2026 Firma congatecHardwareCOM Express Compact, COM-Modul, Computer-on-Module, conga-TC300, edge ai, embedded computing, Entry-Level AI, Industrial Edge, Intel Core Series 3, Low-Power AI, Wildcat Lake, x86 Embedded

congatec – ein führender Anbieter von Embedded und Edge Computing Technologie – stellt das Computer-on-Module (COM) conga-TC300 im COM Express Compact Formfaktor vor, das auf Intel Core Series 3 Prozessoren (Codename: Wildcat Lake) basiert. Damit bringen die applikationsfertigen aReady.COM Module Mehr

Extraordinary AI performance from -40 to +85 °C for rugged applications

31. März 2026 Firma congatecHardwareCOM Express, COM-HPC, computer-on-modules, industrial temperature range, Intel Core Ultra Series 3, Intel Panther Lake, rugged embedded systems

congatec – a leading vendor of embedded and edge computing building blocks – is expanding its portfolio of Computer-on-Modules (COMs) with Intel Core Ultra Series 3 processors to include variants for the extended industrial temperature range of -40 °C to Mehr

aReady.COM conga-SMX95 optimiert Time-to-Market und Nutzungsmöglichkeiten

12. März 202617. März 2026 Firma congatecHardwareApplikationssoftware, arm, Betriebssysteme, computing, Designbasis, Dev-Management, Edge, embedded, Hardware-Lösungen, Industrieanwendungen, konnektivität, rechenleistung, Software-Building-Blocks, Systemintegration, zertifizierung

congatec – der führende Anbieter von Embedded und Edge Computing Technologie – überführt sein Angebot an applikationsfertigen aReady. Software-Building-Blocks nun auch auf seine Arm basierten Computer-on-Modules. Den Anfang macht das erfolgreiche SMARC Module conga-SMX95 auf Basis der i.MX95 Applikationsprozessoren von Mehr

aReady.COM conga-SMX95 optimizes time-to-market and expands usage potential

12. März 202617. März 2026 Firma congatecHardwareapplication-ready solutions, aReady.COM, arm, computer-on-modules, congatec, development cycles, embedded computing, industrial applications, manufacturing efficiency, NXP Semiconductors, real-time computing, smarc, System-Integration

congatec – the leading provider of embedded and edge computing technology – is extending its portfolio of application-ready aReady. software building blocks to include Arm-based Computer-on-Modules. The first product in this expansion is the successful SMARC module conga-SMX95, based on Mehr

congatec and Kontron partner on embedded computing solutions

11. März 202616. März 2026 Firma congatecHardwareagility, aReady.YOURS, automation, computing, congatec, embedded, innovation, integration, iot, modular?, regulatory, solutions, systems?, technology, turnkey

congatec – the leading provider of embedded and edge computing technology – is expanding its portfolio of customized embedded computing platforms. With the launch of the aReady.YOURS Partner Program, the company is strengthening its ability to deliver added value to Mehr

congatec und Kontron schließen Partnerschaft für Embedded Computing Lösungen

11. März 202616. März 2026 Firma congatecHardwareAgilität, Branchenlösungen, computing, embedded, Embedded Systeme, Hardware-Integration, iot, kontron, Marktanpassung, oems, Plattformen, Qualitätsstandards, Systemdesigns, zertifizierungen

congatec – der führende Anbieter von Embedded und Edge Computing Technologie – erweitert sein Lösungsangebot für kundenspezifische Embedded-Computing-Plattformen. Mit dem aReady.YOURS-Partner-Programm zündet das Unternehmen die nächste Wertschöpfungsstufe für OEMs. Ziel ist es, gemeinsam mit Lösungspartnern schlüsselfertige Systemdesigns für Märkte mit Mehr

conga-TCRP1 combines high performance with maximum scalability and design flexibility

11. März 202616. März 2026 Firma congatecHardwareAI applications, amd, conga-TCRP1, edge computing, embedded systems, High Performance Computing, performance, performance optimization, real-time workloads, Ryzen AI P100, Scalability, scalable architecture

congatec – the leading vendor of embedded and edge computing technology – is enhancing the performance and scalability of its AMD Ryzen™ AI Embedded P100 Series COM Express 3.1 Type 6 Compact modules. The conga-TCRP1 is now available in six new variants with Mehr

Skalierbare Edge-Performance für anspruchsvolle Applikationen

11. März 202616. März 2026 Firma congatecHardwareAI, computing, conga-TCRP1, datensicherheit, Echtzeit-Workloads, edge computing, embedded, Hardwarelösungen, High Performance, industrie 4.0, Medical-Technologie, performance, Robotik, Skalierbarkeit, smart city

congatec – der führende Anbieter von Embedded- und Edge-Computing-Technologie – erhöht die Performance und Skalierbarkeit seiner AMD Ryzen AI Embedded P100 Series basierten COM Express 3.1 Type 6 Compact Module. Das conga-TCRP1 ist ab sofort in sechs neuen Varianten mit Mehr

aReady.YOURS from congatec for fast and reliable (full) custom embedded computing designs

11. März 202616. März 2026 Firma congatecHardwareapplication, computer-on-modules, computing, cooling, design, embedded, embedded design, engineering, full custom designs, integration, Manufacturing, partnership, services, solution, turnkey

congatec – the leading provider of embedded and edge computing technology – today announced its new Customer Application Center and the launch of aReady.YOURS. With this move, congatec expands its aReady. hardware and software building blocks portfolio to include comprehensive customization design Mehr

congatec expands its highly skilled engineering team, establishing congatec Asia Embedded Design subsidiary

27. Januar 202629. Januar 2026 Firma congatecHardwarecomputing, congatec, congatec new subsidiary, custom solutions, embedded, embedded R&D hub, engineering, innovation, penang, semiconductor

congatec – the leading vendor of embedded and edge computing technology – today announced the establishment of its new subsidiary in Penang, Malaysia, marking a strategic expansion of its engineering and research footprint in Asia. The move signals congatec’s commitment Mehr

Autor: Firma congatec