Unique X-ray Topography Based Defect Characterization for SiC Wafers Honored with Georg Waeber Innovation Award 2023
A cross-organizational team from Rigaku SE and Fraunhofer IISB has established a new semiconductor material characterization method in their jointly operated Center of Expertise for X-ray Topography in Erlangen, Germany. They succeeded not only in developing an industry-ready X-ray topography Mehr





