Firma congatec, Autor bei Presse-Blog

congatec expands its highly skilled engineering team, establishing congatec Asia Embedded Design subsidiary

27. Januar 202629. Januar 2026 Firma congatecHardwarecomputing, congatec, congatec new subsidiary, custom solutions, embedded, embedded R&D hub, engineering, innovation, penang, semiconductor

congatec – the leading vendor of embedded and edge computing technology – today announced the establishment of its new subsidiary in Penang, Malaysia, marking a strategic expansion of its engineering and research footprint in Asia. The move signals congatec’s commitment Mehr

congatec launcht COM Express Compact Modul auf Basis der neuesten AMD Ryzen™ AI Embedded P100 Prozessorserie

20. Januar 202623. Januar 2026 Firma congatecHardwareAI at the edge, AMD Ryzen Embedded AI P100, COM Express, COM Express with Ryzen P100, Computer-on-Module, Edge, embedded, embedded NPU

congatec – der führende Anbieter von Embedded- und Edge-Computing-Technologie – gibt den Launch einer neuen COM Express 3.1 Type 6 Compact Modulserie bekannt. Die neuen conga-TCRP1 basieren auf den neuesten AMD Ryzen™ AI Embedded P100 Series Prozessoren mit 4 oder Mehr

congatec launches COM Express Compact module based on the latest AMD Ryzen™ AI Embedded P100 processor series

20. Januar 202623. Januar 2026 Firma congatecHardwareAI accelerators, AMD P100 Ryzen, AMD Ryzen AI Embedded, COM Express, COM Express with AMD Ryzen AI embedded, Computer-on-Module, congatec, energy efficiency, industrial applications, industrial automation, rugged computing

congatec – the leading provider of embedded and edge computing technology – today launched a new COM Express 3.1 Type 6 Compact module series. The new conga-TCRP1 modules are based on the latest AMD Ryzen™ AI Embedded P100 Series processors Mehr

congatec expands its Computer-on-Module portfolio with 18 new product families

8. Januar 20269. Januar 2026 Firma congatecHardwareacquisition, Computer-on-Module, congatec, CPU density, design optimization, edge computing, embedded systems, global support, hardware innovation, JUMPtec, market leadership, module integration, portfolio, product families, technology roadmap

congatec – a leading vendor of embedded and edge computing technology – is expanding its Computer-on-Module portfolio with 18 new JUMPtec product families. The move follows the acquisition of Kontron’s module business in July 2025. As a result, customers now Mehr

congatec Computer-on-Modules fast-track Intel Core Ultra Series 3 processors for embedded AI without discrete accelerator cards

6. Januar 2026 Firma congatecHardwareaccelerator cards, AI acceleration, Compact design, computer-on-modules, congatec, Deep Learning, edge computing, embedded ai, energy efficiency, Hardware solutions, high-reliability systems, Intel Core Ultra Series 3, IoT Integration, machine learning, modular architecture

congatec – a leading vendor of embedded and edge building blocks – today launched the industry’s broadest portfolio of Computer-on-Modules (COMs) based on Intel Core Ultra Series 3 processors . The new high-performance modules deliver up to 180 TOPS of Mehr

Kontron and congatec unite to deliver secure embedded solutions

26. November 202526. November 2025 Firma congatecHardwareareadycom, congatec, ECT, energy, greentec, iot, katek, kontron, kontronos, market, niederhauser, security, solar, with, wwwkontroncom

congatec – a leading vendor of embedded and edge computing technology – and Kontron – a leading global provider of IoT/Embedded Computer Technology (ECT) – today announced new modular and secure embedded platforms. At the core of this collaboration is Mehr

Kontron und congatec bündeln ihre Kräfte für sichere Embedded-Lösungen

26. November 202526. November 2025 Firma congatecHardwareaready, areadycom, congatec, congatecs, cra, Edge, embedded, iot, kontron, kontronos, ktn, niederhauser, non, software, wwwkontroncom

congatec – ein führender Anbieter von Embedded und Edge Computer Technologie – präsentiert gemeinsam mit Kontron – einem weltweit führenden Anbieter von Embedded- und IoT-Lösungen – neue, modulare und sichere Embedded-Plattformen. Im Mittelpunkt steht dabei die Kombination von KontronOS, dem Mehr

congatec takes embedded ARM modules to a new level of performance

25. November 202525. November 2025 Firma congatecHardwarearm, COM-HPC, congatec, edge computing, embedded, energieeffizienz, Hardwareintegration, iot, künstliche intelligenz, mikroprozessoren, mini, Robustheit, Systemintegration, Technologie, Videodaten

congatec – a leading vendor of embedded and edge computing technology – launched its first COM-HPC Mini Computer-on-Module (COM) powered by the Qualcomm Dragonwing™ IQ-X Series processors. The new conga-HPC/mIQ-X with the Qualcomm® Oryon™ CPU delivers exceptional single and multithread Mehr

congatec hebt embedded Arm-Module auf neues Performance-Level

25. November 202525. November 2025 Firma congatecHardwareCOM-HPC, Computer-on-Module, congatec, Embedded-Technologie, energieeffizienz, industrie automation, IoT-Funktionalität, kamerasysteme, Kühllösungen, medizintechnik, mini, qualcomm, Robotik, softwareintegration, TPM 2.0

congatec – ein führender Anbieter von Embedded- und Edge-Computing-Technologie – launcht sein erstes COM-HPC Mini Computer-on-Module (COM) mit Qualcomm Dragonwing™ IQ-X Prozessoren. Das neue conga-HPC/mIQ-X mit der Qualcomm® Oryon™ CPU bietet bei herausragender Energieeffizienz eine Single- und Multithread-Performance, die bisher Mehr

congatec simplifie la consolidation système en intégrant Hypervisor sur ses Computer-on-Modules x86

30. Januar 202430. Januar 2024 Firma congatecHardwarecongatec, conteneurs, embedded, est, les, linux, microsoft, neutrino, qnx, ses, sont, systeme, systèmes, tenasys, une

congatec – l’un des principaux fournisseurs de technologies embarquées et edge computing – intègre désormais Hypervisor dans tous ses nouveaux COM x86. Hypervisor de la société a été facilement ajouté aux Computer-on-Modules (COM) basés sur x86 de congatec. Désormais, Hypervisor Mehr

Autor: Firma congatec